Won-Chul Moon

Application of MEMS Technology in Microelectronic Packaging

Seung-Boo Jung, Dae-Gon Kim, Jong-Woong Kim, 2006 .

Nanotechnology based on DNA computation

Hiroshi Iwasaki, Akio Nishikawa, Tatsuo Yoshinobu, 2001 .

Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

Jong-Woong Kim, Seung-Boo Jung, Won-Chul Moon, 2006 .

Flip-chip Bonding Technology and Reliability of Electronic Packaging

Sang-Su Ha, Jong-Woong Kim, Seung-Boo Jung, 2007 .