Jeong-Hoon Moon

Application of MEMS Technology in Microelectronic Packaging

Seung-Boo Jung, Dae-Gon Kim, Jong-Woong Kim, 2006 .

A study about gate driver for high speed switching

Sung-Jun Park, Ji-Hoon Yang, Jung-Goo Hwang, 2016, 2016 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific).

Real-time Networked 2K Video Transfer with Light-weight Software CODEC

JongWon Kim, Jinyong Jo, Jaiseung Kwak, 2008 .

Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate

Jong-Woong Kim, Seung-Boo Jung, Bo-In Noh, 2008 .

Flip-chip Bonding Technology and Reliability of Electronic Packaging

Sang-Su Ha, Jong-Woong Kim, Seung-Boo Jung, 2007 .