Mignot Yann

A review of the mechanical stressors efficiency applied to the ultra-thin body & buried oxide fully depleted silicon on insulator technology

Pierre Morin, Sylvain Maitrejean, Frederic Allibert, 2016 .

56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

Mignot Yann, Walter Kleemeier, Philip L. Flaitz, 2013 .