A. C. T. Quah

Enhancing die level static fault isolation on power gated devices

D. Nagalingam, P. T. Ng, C. Q. Chen, 2020 .

Static fault localization of subtle metallization defects using near infrared photon emission microscopy

Jeffrey Lam, G. B. Ang, Z. H. Mai, 2017, Microelectron. Reliab..

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Static fault localization on Memory failures using Photon Emission Microscopy

C. Q. Chen, J. Lam, G. B. Ang, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Detection of solder bump marginal contact resistance degradation using 4-point resistance measurement method

J. Lam, D. Nagalingam, G. B. Ang, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue

G. B. Ang, Z. H. Mai, A. C. T. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).