F. Iker

Design and Integration Technology for Miniature Medical Microsystems

C. Van Hoof, H. Neves, A.A.A. Aarts, 2008, 2008 IEEE International Electron Devices Meeting.

Process technology for the fabrication of a Chip-in-Wire style packaging

C. Van Hoof, F. Iker, P. Soussan, 2008, 2008 58th Electronic Components and Technology Conference.

Technology platform for 3-D stacking of thinned embedded dies

F. Iker, P. Soussan, E. Beyne, 2008, 2008 58th Electronic Components and Technology Conference.

Diamond bit cutting for processing high topography wafers

F. Iker, P. Soussan, A. Andrei, 2009, 2009 11th Electronics Packaging Technology Conference.