Philippe M. Vereecken

发表

3D Structuring of Thin Film Solid State Batteries for High Power Demanding Applications

A. Sepúlveda, Brecht Put, Nouha Labyedh, 2016 .

Electrochemical Characterization of Lithiation and De-Lithiation of Ultra-Thin Amorphous TiO 2 Films

Cedric Huyghebaert, Stefan De Gendt, Philippe M. Vereecken, 2014 .

Electrochemical Catalyst Placement for Bottom-up Nanoelectronics

Philippe M. Vereecken, Guido Groeseneken, Geoffroy Hautier, 2006 .

An ELISA-based amperometric biosensor within a photo-patternable adhesive microfluidic channel

Yan Li, Liesbet Lagae, Philippe M. Vereecken, 2015, 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Nanotechnology ‚Äì can 0D, 1D and 2D processes enable 3D CMOS applications?

Stefan De Gendt, Philippe M. Vereecken, Marleen H. van der Veen, 2010 .

Effect of Additives on Shape Evolution during Electrodeposition II. Parameter Estimation from Roughness Evolution Experiments

Richard D. Braatz, Philippe M. Vereecken, Effendi Rusli, 2007 .

Magnetotransport properties of bismuth films on p-GaAs

Philippe M. Vereecken, Peter C. Searson, Daniel H. Reich, 2000 .

Effects of laminar flow within a versatile microfluidic chip for in-situ electrode characterization and fuel cells

Yan Li, Liesbet Lagae, Philippe M. Vereecken, 2017 .

Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers

Philippe M. Vereecken, John Slabbekoorn, Herbert Struyf, 2016 .

Electrochemical Deposition of FeCo and FeCoV Alloys

Philippe M. Vereecken, Peter C. Searson, I. Shao, 2003 .

Synthesis of large area carbon nanosheets for energy storage applications

Iuliana Radu, Stefan De Gendt, Philippe M. Vereecken, 2013 .

Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth

Philippe M. Vereecken, Matty Caymax, Bart Blanpain, 2007 .

Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration

Jean-Pierre Celis, Philippe M. Vereecken, Wouter Ruythooren, 2009 .

Plasma-enhanced atomic layer deposition of iron phosphate as a positive electrode for 3D lithium-ion microbatteries

Philippe M. Vereecken, Christophe Detavernier, Thomas Dobbelaere, 2016 .

Effect of Additives on Shape Evolution during Electrodeposition III. Trench Infill for On-Chip Interconnects

Richard D. Braatz, Philippe M. Vereecken, Panayotis C. Andricacos, 2008 .