Susan Fan

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node

Karen Petrillo, Andrew Metz, Shinichiro Kawakami, 2010, Advanced Lithography.