Erin McLellan

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

Hybrid metrology solution for 1X node technology

Alok Vaid, Hiroki Kawada, Cornel Bozdog, 2012, Advanced Lithography.

In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection

Alok Vaid, Benjamin Bunday, Oliver D. Patterson, 2013, Advanced Lithography.