Tom Winter

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

Defectivity issues in topcoat-free photoresists

Will Conley, Youri van Dommelen, Karen Petrillo, 2009, Advanced Lithography.

Defectivity issues in topcoatless photoresists

Will Conley, Karen Petrillo, Shannon Dunn, 2009 .