John Slabbekoorn

Large area interposer lithography

Eric Beyne, Manish Ranjan, Andy Miller, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Reflow process optimization for micro-bumps applications in 3D technology

Eric Beyne, Erik Jan Marinissen, Andy Miller, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Overlay performance of through Si via last lithography for 3D packaging

Warren W. Flack, Piotr Czarnecki, Andy Miller, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Cost components for 3D system integration

Eric Beyne, Erik Jan Marinissen, Anne Jourdain, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

VERIFICATION OF BACK-TO-FRONT SIDE ALIGNMENT

Warren W. Flack, Robert Hsieh, Gareth Kenyon, 2012 .

OPTIMIZATION OF THROUGH SI VIA LAST LITHOGRAPHY FOR 3 D PACKAGING

Warren W. Flack, Robert Hsieh, Gareth Kenyon, 2015 .

Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers

Philippe M. Vereecken, John Slabbekoorn, Herbert Struyf, 2016 .

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Eric Beyne, Andy Miller, John Slabbekoorn, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

BOSCH PROCESS CHARACTERIZATION FOR DONUT TSV ’ S

Andy Miller, Robert Hsieh, John Slabbekoorn, 2015 .

MICROBUMP LITHOGRAPHY FOR 3 D STACKING APPLICATIONS

Patrick Jaenen, Robert Hsieh, Gareth Kenyon, 2013 .

3D stacking using bump-less process for sub 10 µm pitches

Eric Beyne, Anne Jourdain, Andy Miller, 2016, ECTC 2016.