Bruce Kim

Package Electrical Testing

Abhijit Chatterjee, Madhavan Swaminathan, K. Sasidhar, 1997 .

W-COST DC BUILT-IN SELF-TEST OF LINEAR ANALOG C USING CHECKSUMS

Abhijit Chatterjee, Naveena Nagi, Bruce Kim, 1996 .

MEMS Integrated Packaging for RF Circuit Testing and Self Calibration

Anurag Gupta, Seok-Ho Noh, Bruce Kim, 2011 .

System-on-Chip Integrated MEMS Packages for RF LNA Testing and Self-Calibration

Seok-Ho Noh, Bruce Kim, Sukeshwar Kannan, 2011 .

A novel BIST technique for LDMOS drivers

Friedrich Taenzler, Saikat Mondal, Bruce Kim, 2014, 2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS).

Development of MEMS Power Sensor Package

Bruce Kim, Rahim Kasim, 2010 .

A novel test technique for MCM substrates

Madhavan Swaminathan, D. E. Schimmel, A. Chatterjee, 1997 .

Development of analog circuit design automation tool

Bruce Kim, Vinitha Krishnamurthy, 2009, IEEE Southeastcon 2009.

Forced-resonance test technique for multiple wirebonds in electronic packages

Friedrich Taenzler, Bruce Kim, Sukeshwar Kannan, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Novel ESD Protection Scheme for Testing High Voltage LDMOS

Sukeshwar Kannan, Friedrich Taenzler, Ken Moushegian, 2012 .

Tunable 3D TSV-based inductor for integrated sensors

Saikat Mondal, Bruce Kim, Seok Ho Noh, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).