M.S. Bakir

Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems

Bing Dang, M.S. Bakir, C. King, 2008, 2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference.

Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

J.D. Meindl, B. Dang, M.S. Bakir, 2006, IEEE Electron Device Letters.

3D stacking of chips with electrical and microfluidic I/O interconnects

J.D. Meindl, B. Dang, M.S. Bakir, 2008, 2008 58th Electronic Components and Technology Conference.

Sea of leads: a disruptive paradigm for a system-on-a-chip (SoC)

J.D. Meindl, A. Naeemi, M.S. Bakir, 2001, 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177).