C. Marghescu

Modeling and simulation of inductive structures for non-invasive medical uses

B. Mihailescu, P. Svasta, I. Plotog, 2013, 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).

Simulation of a wireless sensor network using OPNET

P. Svasta, A. Brodeala, M. Pantazica, 2011, 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME).

A study of SW150 conductive paste as a possible use in solderless assembly for electronics

P. Svasta, G. Varzaru, C. Marghescu, 2016, 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME).

Design of a Capacitive LTCC-based Pressure Sensor

P. Svasta, D. Belavic, M. Hrovat, 2009, 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).