Renke Kang

发表

Generation of rotationally symmetric surfaces by infeed grinding with a rotary table and a cup wheel

Zhe Li, Fengwei Huo, Dongming Guo, 2013 .

Multipoint support technology for mirror milling of aircraft skins

Yan Bao, Dongming Guo, Renke Kang, 2018 .

Research on topography control of two-spindle and three-workstation wafer grinder

X L Zhu, Renke Kang, G Feng, 2011 .

Three-point-support method based on position determination of supports and wafers to eliminate gravity-induced deflection of wafers

Xiuyi Chen, Haijun Liu, Renke Kang, 2016 .

Analysis of deformation in the manufacturing process of seal ring with wavy face using the pre-deformation plane lapping method

Yu Wang, Ping Zhou, Dongming Guo, 2015 .

Ultra-precision grinding of asymmetric curved surfaces by line contact with cup wheel

Dongming Guo, Guang Feng, Zhuji Jin, 2013 .

Analysis and Compensation Following Error of Feed Drive in CNC

Ke Xin Wang, Yong Qi Wang, Renke Kang, 2010 .

A new kinematics for ultra precision grinding of conical surfaces using a rotary table and a cup wheel

Dong Ming Guo, Guang Feng, Renke Kang, 2012 .

Optimization of support location in mirror-milling of aircraft skins

Bi Zhang, Yan Bao, Dongming Guo, 2018 .

Development of Piezoelectric Three-Dimensional Dynamometer for Φ300mm Wafer Grinder

Wei Wang, Jun Zhang, Zongjin Ren, 2014 .

Modeling on the Ground Wafer Shape in Wafer Rotational Grinding

Renke Kang, Ke Yan Tang, 2010 .

A New Ultra-Precision Grinding Method for Manufacturing the Wavy-Tilt-Dam Mechanical Face Seals

Fengwei Huo, Dongming Guo, Guang Feng, 2013 .

Ultra-precision grinding of a hydrostatic mechanical sealing ring face with extremely shallow taper angle

Renke Kang, F W Huo, D M Guo, 2011 .

Changes in surface layer of silicon wafers from diamond scratching

Bo Wang, Dongming Guo, Renke Kang, 2015 .

Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process

Jun Shimizu, Libo Zhou, Renke Kang, 2009 .

Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories

Xi Qu Chen, Jian Xiu Su, Renke Kang, 2008 .

Modeling of Back Pressure Distribution on the Wafer Loaded in a Multi-Zone Carrier in Chemical Mechanical Polishing

Renke Kang, Dong Ming Guo, Yu Hui Sun, 2006 .

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Jian Xiu Su, Zhuji Jin, Renke Kang, 2004 .

Numerical study on thermal deformation characteristic of water-cooled mirror with interdigitated channels

Ping Zhou, Renke Kang, Zhigang Dong, 2016 .

Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

Dongming Guo, Xiaoguang Guo, Zhuji Jin, 2017 .

Friction-Based In Situ Endpoint Detection of Copper CMP Process

Zhuji Jin, Renke Kang, Dong Ming Guo, 2008 .

Inverse Method for Determining Grinding Area and Material Removal Amount in Grinding Radome

Renke Kang, Y. W. Sun, Dong Ming Guo, 2007 .

A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers

Bo Liu, Jun Zhang, Min Qian, 2010 .

Development of Ultra-Precision Grinder for 300mm Wafers

Renke Kang, Zhigang Dong, Dong Ming Guo, 2012 .

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Hang Gao, Yan Li, Dongjiang Wu, 2010 .

Warping of silicon wafers subjected to back-grinding process

Dongming Guo, Renke Kang, Zhigang Dong, 2015 .

A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers

Ping Zhou, Dongming Guo, Renke Kang, 2016 .

Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: An experimental investigation on surface roughness

Hang Gao, Z. J. Pei, Renke Kang, 2009 .

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Jian Xiu Su, Zhuji Jin, Renke Kang, 2004 .

Surface quality of carbon/carbon composite after ultrasonic assisted turning

Renke Kang, D. Guo, F. J. Ma, 2011 .

A novel approach of high-performance grinding using developed diamond wheels

Bo Wang, Dongming Guo, Qian Bai, 2017 .

Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method

Shang Gao, Ping Zhou, Renke Kang, 2015 .

Milling Force and Machining Deformation in Mirror Milling of Aircraft Skin

Zhao Li, Renke Kang, Zhigang Dong, 2016 .

Edge chipping of silicon wafers in diamond grinding

Renke Kang, Zhigang Dong, Z. Dong, 2013 .

Rotary Ultrasonic Machining of Potassium Dihydrogen Phosphate (KDP) crystal: an experimental investigation

Hang Gao, Z. J. Pei, Renke Kang, 2009 .

Truing of Diamond Wheels by Laser

Yu Zhang, Renke Kang, J. T. Yuan, 2001 .