Wolfgang Pahl

Miniaturized electric component having a stack of a MEMS and ASIC

Feiertag Gregor, Wolfgang Pahl, Hans Krüger, 2010 .

Electronic component, working in particular with surface acoustic wave device - SAW component -

Wolfgang Pahl, Alois Stelzl, Hans Krueger, 1995 .

Flip chip MEMS microphone package with large acoustic reference volume

Wolfgang Pahl, Gregor Feiertag, Matthias Winter, 2010 .

Miniaturized electrical component with a mems and an asic

Wolfgang Pahl, Hans Krüger, Gregor Feiertag, 2010 .

Flip-chip MEMS microphone package with small front-volume and large back-volume

Wolfgang Pahl, Anton Leidl, Christian Siegel, 2015, 2015 European Microelectronics Packaging Conference (EMPC).

A housed electrical component

Wolfgang Pahl, Portmann Jürgen, 2010 .

Flip-chip packaging of piezoresistive barometric pressure sensors

Wolfgang Pahl, Matthias Schmidt, R. Dudek, 2013, Microtechnologies for the New Millennium.

Electrical module with a MEMS microphone

Wolfgang Pahl, Leidl Anton, Wolff Ulrich, 2005 .

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

Wolfgang Pahl, Anton Leidl, G. Feiertag, 2014 .