Kim S. Siow

Setting up an intellectual properties intermediary service: DMAIC way

Kim S. Siow, 2014, 2014 IEEE International Conference on Industrial Engineering and Engineering Management.

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Simon S. Ang, Kim S. Siow, S. Ang, 2019 .