Jack Jau

发表

Challenges of systematic defect control in advanced DRAM Fab

Luke Lin, J.Y. Chen, Wen-Yi Wong, 2008, 2008 International Symposium on Semiconductor Manufacturing (ISSM).

Leakage monitoring and control with an advanced e-beam inspection system

Jack Jau, Hong Xiao, Hermes Liu, 2006, SPIE Advanced Lithography.

E-beam inspection system for comparison of wafer and design data

Fei Wang, Jack Jau, Shuen Cheng Lei, 2012, Advanced Lithography.

Study of devices leakage of 45nm node with different SRAM layouts using an advanced e-beam inspection systems

Yan Zhao, Hong Xiao, Jack Jau, 2009, Advanced Lithography.

In-line semi-electrical process diagnosis methodology for integrated process window optimization of 65nm and below technology nodes

Jack Jau, M. S. Liang, Chin C. Hsia, 2006, SPIE Advanced Lithography.

High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Fei Wang, Xu Zhang, Jack Jau, 2011, Advanced Lithography.

Process window and defect monitoring using high-throughput e-beam inspection guided by computational hot spot detection

Sandip Halder, Pengcheng Zhang, Jack Jau, 2016, SPIE Advanced Lithography.

EUV mask pattern inspection with an advanced electron beam inspection system

Tadahiko Takikawa, Yasutaka Morikawa, Naoya Hayashi, 2009, Lithography Asia.

Optical beam enhanced defect detection with electron beam inspection tools

Fei Wang, Yan Zhao, Hong Xiao, 2008, 2008 International Symposium on Semiconductor Manufacturing (ISSM).

Study of ADI (After Develop Inspection) on photo resist wafers using electron beam (II)

Jack Jau, Joseph H. Lin, Teruyuki Hayashi, 2007, SPIE Advanced Lithography.

Demonstration of defect free EUV mask for 22nm NAND flash contact layer using electron beam inspection system

Tadahiko Takikawa, Satoshi Kawashima, Naoya Hayashi, 2011, Advanced Lithography.

Electron beam charging of a SiO2 layer on Si: a comparison between Monte Carlo-simulated and experimental results

Jack Jau, Teruyuki Hayashi, Misako Saito, 2008, Lithography Asia.

65-nm photolithography process window qualification study with advanced e-beam metrology and inspection systems

Jack Jau, Wei-Yih Wu, Ruei Hung Hsu, 2006, SPIE Advanced Lithography.

After development inspection (ADI) studies of photo resist defectivity of an advanced memory device

Fei Wang, Byoung-Ho Lee, Jack Jau, 2009, Lithography Asia.

Study of program defects of 22nm nanoimprint template with an advanced e-beam inspection system

Yasutaka Morikawa, Satoshi Yusa, Naoya Hayashi, 2009, Photomask Technology.

After development inspection defectivity studies of an advanced memory device

Fei Wang, Byoung-Ho Lee, Jack Jau, 2010, Advanced Lithography.

Inspection of 32nm imprinted patterns with an advanced e-beam inspection system

Fei Wang, S. V. Sreenivasan, Hong Xiao, 2009, Photomask Technology.

High-throughput contact critical dimension and gray level value measurement

Hong Xiao, Jack Jau, Yan Zhao, 2006, SPIE Advanced Lithography.

E-beam inspection of EUV mask defects: To etch or not to etch?

Scott Halle, Fei Wang, Ravi Bonam, 2014, Advanced Lithography.

Study of ADI (After Develop Inspection) on photo resist wafers using electron beam (III): novel method for ADI on metal hard mask by penetration contrast

Jack Jau, Teruyuki Hayashi, Misako Saito, 2008, SPIE Advanced Lithography.

Native pattern defect inspection of EUV mask using advanced electron beam inspection system

Tadahiko Takikawa, Naoya Hayashi, Jack Jau, 2010, Photomask Technology.

Electron beam inspection of 16nm HP node EUV masks

Fei Wang, Yan Zhao, Tadahiko Takikawa, 2012, Photomask Technology.

Study of design-based e-beam defect inspection for hotspot detection and process window characterization on 10nm logic device

Sandip Halder, Jack Jau, Fei Wang, 2016, SPIE Advanced Lithography.

Inspection method and system

Wei Fang, Jack Jau, Zhao-Li Zhang, 2016 .

High-resistance W-plug monitoring with an advance e-beam inspection system

Jack Jau, Hong Xiao, Hermes Liu, 2006, SPIE Advanced Lithography.

Contact leakage and open monitoring with an advanced e-beam inspection system

Jack Jau, Hermes Liu, Mingsheng Tsai, 2007, SPIE Advanced Lithography.

E-beam inspection of EUV programmed defect wafers for printability analysis

Fei Wang, Scott Halle, Ravi Bonam, 2013, ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.

Modelling and observations of electron beam charging of an insulator/metal bilayer and its impact on secondary electron images in defect inspection equipment.

Jack Jau, Misako Saito, Kaoru Ohya, 2010, Journal of electron microscopy.

Investigation and solution of bump-like killer defects

Jack Jau, Hong Xiao, Tan Yong Seng, 2008, 2008 International Symposium on Semiconductor Manufacturing (ISSM).