Miguel Jimarez

Ultra large System-in-Package (SiP) module and novel packaging solution for networking applications

Mohan Nagar, Mudasir Ahmad, Weidong Xie, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCMBGA)

Ahmer Syed, Miguel Jimarez, Bora Baloglu, 2013 .

Lead Free Flip Chip Reliability for Various Package Types

Nokibul Islam, WonJoon Kang, Ahmer Syed, 2011 .

Warpage Characterization and Improvements for IC Packages with Coreless Substrate

Wei Lin, Miguel Jimarez, Bora Baloglu, 2013 .

Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform

Miguel Jimarez, 2016 .

MCM-L Substrates for a 300 MHz Workstation

Miguel Jimarez, David C. Carey, Terri Houston, 1995 .

Study of FCMBGA with low CTE core substrate

Nokibul Islam, Miguel Jimarez, Robert Darveaux, 2009, 2009 59th Electronic Components and Technology Conference.