Ryan Clarke

A three-dimensional DRAM using floating body cell in FDSOI devices

Aamir Zia, Russell P. Kraft, John F. McDonald, 2012, 2012 IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS).

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers

Aamir Zia, Philip Jacob, Jin Woo Kim, 2009, 2009 IEEE International Conference on 3D System Integration.

Design of BiCMOS SRAMs for high-speed SiGe applications

Aamir Zia, Michael Chu, Russell P. Kraft, 2014, IET Circuits Devices Syst..

Evaluating the Impact of the Girls Who Code Summer Immersion Program: (Abstract Only)

Ryan Clarke, Sarah Judd, 2018, SIGCSE.

Demonstration of superconducting memory for an RQL CPU

Harold Hearne, Timothy Lee, Ryan Clarke, 2018, MEMSYS.

Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology

Michael Chu, Russell P. Kraft, John F. McDonald, 2014, IEEE Transactions on Circuits and Systems II: Express Briefs.

High-Speed Serial Circuits Using SiGe HBT BiCMOS Technology

Ryan Clarke, 2015 .

Lashkar-I-Taiba: The Fallacy of Subservient Proxies and the Future of Islamist Terrorism in India

Ryan Clarke, Ryan Clarke, 2010 .