D. Vandepitte

Nonlinear analysis of Ariane 5 engine frame

D. Vandepitte, E. Riks, 1992 .

Dealing with IC package material and design uncertainties using FUZZY finite elements

B. Vandevelde, D. Vandepitte, I. Konstantinou, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Non-iterative analysis of frames including the P-Δ-effect

D. Vandepitte, 1982 .

The organization of a mixed farm and the introduction of open air vegetable growing: a linear programming application.

D. Vandepitte, W. Vandepitte, 1980 .

Peer Review European Style

D. Vandepitte, 1990 .

Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits

E. Beyne, G. Van der Plas, I. De Wolf, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology

E. Beyne, G. Eneman, P. Verheyen, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

FET arrays as CPI sensors for 3D stacking and packaging characterization

E. Beyne, G. Van der Plas, I. De Wolf, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture

E. Beyne, G. Eneman, S. Stoukatch, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Thermomechanical models for leadless solder interconnections in flip chip assemblies

Bart Vandevelde, Eric Beyne, Joris Peeters, 1998 .

The underfill-microbump interaction mechanism in 3D ICs: Impact and mitigation of induced stresses

E. Beyne, I. De Wolf, A. Ivankovic, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

An indirect Trefftz method for the steady-state dynamic analysis of coupled vibro-acoustic systems

P. Sas, D. Vandepitte, D. Vandepitte, 1999 .