Robert S. Patti

发表

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs In 3D integrated circuits, analog, digital, flash and DRAM wafers are processed separately, then brought together in an integrated vertical stack.

Robert S. Patti, 2006 .

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert S. Patti, R. Patti, 2006, Proceedings of the IEEE.