Patrick N. Stover

8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm2, 1mm Package-on-Package

Sanjeev Khushu, Wilfred Gomes, Lei Jiang, 2020, 2020 IEEE International Solid- State Circuits Conference - (ISSCC).