L. T. Nguyen

Assembly-level reliability: a methodology for effective manufacturing of IC packages

L. T. Nguyen, J. R. Finnell, K. M. Singh, 1995 .

Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools

L. T. Nguyen, A.-Y. Kuo, A. Kuo, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).