Gayle Murdoch

Dense lines created by spacer DPT scheme: process control by local dose adjustment using advanced scanner control

Jo Finders, Timon Fliervoet, Mireille Maenhoudt, 2009, Advanced Lithography.

Directed self-assembly enabled fully self-aligned via processing (Conference Presentation)

Roel Gronheid, Jürgen Bömmels, Ryoung-Han Kim, 2017, Advanced Lithography.

Gallium arsenide linearised electro-optic waveguide modulators for RF-on-fibre applications

Andrew Miller, Yi Zhou, Harry Gao, 2008, Security + Defence.

Process development using negative tone development for the dark field critical layers in a 28nm node process

Vincent Wiaux, Peter De Bisschop, Monique Ercken, 2012, Advanced Lithography.

Self-aligned block and fully self-aligned via for iN5 metal 2 self-aligned quadruple patterning

Sandip Halder, Joern-Holger Franke, Joseph Ervin, 2018, Advanced Lithography.

193nm immersion lithography for high-performance silicon photonic circuits

Wim Bogaerts, Joris Van Campenhout, Patrick Ong, 2014, Advanced Lithography.

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Eric Beyne, Luka Kljucar, Ingrid De Wolf, 2017, Microelectron. Reliab..

EPE analysis of sub-N10 BEoL flow with and without fully self-aligned via using Coventor SEMulator3D

William W. Clark, Sandip Halder, Matt Gallagher, 2017, Advanced Lithography.

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps

Naoto Horiguchi, Zsolt Tokei, Alicja Lesniewska, 2021, 2021 IEEE International Reliability Physics Symposium (IRPS).

Advanced 300-mm waferscale patterning for silicon photonics devices with record low loss and phase errors

Shankar Kumar Selvaraja, Wim Bogaerts, Joris Van Campenhout, 2012 .

Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Selective co growth on Cu for void-free via fill

John Zhu, Mustafa Badaroglu, William Hunks, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Subtractive Etch of Ruthenium for Sub-5nm Interconnect

Christopher J. Wilson, Christoph Adelmann, Monique Ercken, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).