James F. Loan

Materials delivery challenges in ULSI processing

Laura A. Sullivan, James F. Loan, John J. Sullivan, 1995, Advanced Lithography.

Profile simulation of conformality of chemical vapor deposited copper in subquarter-micron trench and via structures

James F. Loan, E. Eisenbraun, A. Kaloyeros, 1997 .

In situ quadrupole mass spectroscopy studies of water and solvent coordination to copper(II) β-diketonate precursors: implications for the chemical vapor deposition of copper

James F. Loan, E. Eisenbraun, A. Kaloyeros, 1995 .

Chemical vapor deposition of copper from CuI hexafluoroacetylacetonate trimethylvinylsilane for ultralarge scale integration applications

James F. Loan, A. Kaloyeros, D. Manger, 1996 .