Girish A. Dixit

0.25-μm multilevel interconnect with DUV processing

William L. Krisa, Sonya Yvette Shaw, Ken Brennan, 1997, Advanced Lithography.

Local connections for integrated circuits.

Girish A. Dixit, Fu-Tai Liou, Fusen Chen, 1992 .

Chemical Vapor deposition (CVD) TiN: a barrier metallization for submicron via and contact applications

Girish A. Dixit, Manoj K. Jain, Rod Mosely, 1994, Advanced Lithography.

Chemical mechanical planarization of multilayer dielectric stacks

Girish A. Dixit, Manoj K. Jain, Gregory B. Shinn, 1994, Advanced Lithography.

Application of force fill Al-plug technology to 64 Mb DRAM and 0.35 /spl mu/m logic

Girish A. Dixit, M. Utsugi, Scott Poarch, 1995, 1995 Symposium on VLSI Technology. Digest of Technical Papers.

Dimensional metrology challenges for ULSI interconnects

Girish A. Dixit, Herschel M. Marchman, Eden Zielinski, 1998 .

Reactively sputtered coherent TiN process for sub-0.5-μm technology

Girish A. Dixit, Peter J. Wright, Jaim Nulman, 1993, Other Conferences.

A novel 0.25 /spl mu/m via plug process using low temperature CVD Al/TiN

Ashok K. Sinha, Girish A. Dixit, Moshe Eizenberg, 1995, Proceedings of International Electron Devices Meeting.