Chandrasekharan Kothandaraman

Electrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips

Xiang Chen, Subramanian S. Iyer, Toshiaki Kirihata, 2007, 2007 IEEE Custom Integrated Circuits Conference.

Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applications

X. Chen, Subramanian S. Iyer, Toshiaki Kirihata, 2015, 2015 IEEE International Reliability Physics Symposium.

Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability

Fen Chen, J. Liu, Subramanian S. Iyer, 2015, 2015 IEEE International Reliability Physics Symposium.

Three-dimensional wafer stacking using Cu TSV integrated with 45nm high performance SOI-CMOS embedded DRAM technology

Toshiaki Kirihata, John Golz, Alex Hubbard, 2013, 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).