S. Shantaram

Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration

P. Lall, J. Suhling, D. Iyengar, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys

P. Lall, S. Shantaram, P. Lall, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Reliability modeling of electronic systems subjected to high strain rates

P. Lall, S. Shantaram, P. Lall, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

P. Lall, D. Iyengar, S. Shantaram, 2007, IEEE Transactions on Components and Packaging Technologies.

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

P. Lall, D. Iyengar, S. Shantaram, 2008, IEEE Transactions on Electronics Packaging Manufacturing.