Samuel Suhard

Process Complexity and Cost Considerations of Multi-Layer Die Stacks

Eric Beyne, Erik Jan Marinissen, Geert Van der Plas, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Invited) Vertical Nanowire FET Integration and Device Aspects

Nadine Collaert, Aaron Thean, Tsvetan Ivanov, 2016 .

Protective Layer for Collective Die to Wafer Hybrid Bonding

Eric Beyne, Alain Phommahaxay, Samuel Suhard, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Die to wafer 3D stacking for below 10um pitch microbumps

Teng Wang, Eric Beyne, Anne Jourdain, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\textregistered LK HM

David De Roest, Nancy Heylen, Herbert Struyf, 2010 .

A microactuator based on the decomposition of an energetic material for disposable lab-on-chip applications: fabrication and test

Carole Rossi, Daniel Esteve, Samuel Suhard, 2008 .

Heterometallic Werner complexes as energetic materials.

Samuel Suhard, Laure Vendier, Bruno Chaudret, 2008, Dalton transactions.

Low-temperature pre-epitaxy surface cleaning of Si and SiGe

Roger Loo, Andriy Hikavyy, Sandeep Mehta, 2015 .

3D stacking using bump-less process for sub 10 µm pitches

Eric Beyne, Anne Jourdain, Andy Miller, 2016, ECTC 2016.