H. Oprins
发表
R. Gillon,
A. Srinivasan,
B. Vandevelde,
2008,
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
K. Croes,
M. Stucchi,
V. Cherman,
2019,
2019 IEEE International Reliability Physics Symposium (IRPS).
M. Germain,
G. Borghs,
J. Das,
2006,
IEEE Transactions on Electron Devices.
S. Decoutere,
M. Van Hove,
S. Stoffels,
2012,
18th International Workshop on THERMal INvestigation of ICs and Systems.
E. Beyne,
V. Cherman,
M. Stucchi,
2010,
3rd Electronics System Integration Technology Conference ESTC.
E. Beyne,
I. De Wolf,
B. Vandevelde,
2009,
2009 15th International Workshop on Thermal Investigations of ICs and Systems.
E. Beyne,
G. Van der Plas,
V. Cherman,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
E. Beyne,
G. Van der Plas,
V. Cherman,
2011,
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
E. Beyne,
G. Van der Plas,
I. De Wolf,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).
M. Baelmans,
C.J.M. Lasance,
H. Oprins,
2007,
IEEE Transactions on Components and Packaging Technologies.
K. Croes,
C.J. Wilson,
M. Stucchi,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
E. Beyne,
I. De Wolf,
B. Vandevelde,
2009,
2009 11th Electronics Packaging Technology Conference.
G. Van der Plas,
E. Cheng,
A. Srinivasan,
2009,
2009 15th International Workshop on Thermal Investigations of ICs and Systems.