Fang-Jun Leu

ThermalandElectrical Performance Enhancement withaCost-Effective Packaging forHighSpeedMemoryChips

Yin-Po Hung, Tao-Chih Chang, Tsung-Fu Yang, 2007 .

ChipEmbeddedWaferLevelPackaging Technology forStacked RF-SiPApplication

Tao-Chih Chang, Chin-Yao Chang, Tsung-Fu Yang, 2007 .

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Kuo-Shu Kao, Leon Lin, Fang-Jun Leu, 2014 .

Development and characterization of low cost ultrathin 3D interconnect

Wei-Chung Lo, Yu-Hua Chen, Tzu-Ying Kuo, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application

Cheng-Ta Ko, Li-Cheng Shen, Chien-Wei Chien, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).