Ying-Ching Shih

ThermalandElectrical Performance Enhancement withaCost-Effective Packaging forHighSpeedMemoryChips

Yin-Po Hung, Tao-Chih Chang, Tsung-Fu Yang, 2007 .

Development and characterization of rigid-flex interface

Tai-Hong Chen, Shu-Ming Chang, Wei-Chung Lo, 2006, 56th Electronic Components and Technology Conference 2006.

Next Standard Packaging Method for DRAM - Chip-in-Substrate Package

Tao-Chih Chang, Cheng-Ta Ko, Yu-Hua Chen, 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

3D Chip-to-Chip Stacking with Through Silicon Interconnects

Shu-Ming Chang, Hsiang-Hung Chang, Wei-Chung Lo, 2007, 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

Development of Star-Shaped Four-Channel CWDM Optical-Subassembly Module

Enboa Wu, Ying-Ching Shih, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Flexible and ultra-thin embedded chip package

Hsiang-Hung Chang, Cheng-Ta Ko, Yu-Hua Chen, 2009, 2009 59th Electronic Components and Technology Conference.

Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP

Cheng-Ta Ko, Yu-Hua Chen, Tzu-Ying Kuo, 2006, 56th Electronic Components and Technology Conference 2006.

Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application

Cheng-Ta Ko, Li-Cheng Shen, Chien-Wei Chien, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

An innovative chip-to-wafer and wafer-to-wafer stacking

Wei-Chung Lo, Su-Tsai Lu, Yu-Hua Chen, 2006, 56th Electronic Components and Technology Conference 2006.