Hsuan-Hsuan Hsiao

Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices

Yu-Min Lee, Hong-Wen Chiou, Hsuan-Hsuan Hsiao, 2019, ASP-DAC.

A System-Level Thermal Simulator with Automatic Meshing Techniques

Yu-Min Lee, Liang-Chia Cheng, Hsuan-Hsuan Hsiao, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermal modeling and design on smartphones with heat pipe cooling technique

Yu-Min Lee, Liang-Chia Cheng, Hong-Wen Chiou, 2017, 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).