P. Nummila

Mechanical Shock Robustness of Different Wafer Level Chip Scale Package (WLCSP) Types

P. Nummila, M. Johansson, S. Puro, 2007, 2007 9th Electronics Packaging Technology Conference.

Mechanical shock robustness of different WLCSP types

P. Nummila, M. Johansson, S. Puro, 2008, 2008 58th Electronic Components and Technology Conference.