Erik R. Hosler

Intersecting the Quantum Future and the Semiconductor Industry (Conference Presentation)

Bryan M. Barnes, R. Joseph Kline, Erik R. Hosler, 2020 .

Mix-and-match considerations for EUV insertion in N7 HVM

Nelson Felix, Richard Johnson, Allen H. Gabor, 2017, Advanced Lithography.

Dual frequency mid-gap capacitively coupled plasma (m-CCP) for conventional and DSA patterning at 10nm node and beyond

Akiteru Ko, Ji Xu, Nihar Mohanty, 2014, Advanced Lithography.