Jeng-Shien Hsieh

Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications

Chung-Hao Tsai, Jeng-Shien Hsieh, Monsen Liu, 2013, 2013 IEEE International Electron Devices Meeting.

Ultra-low-resistance 3D InFO inductors for integrated voltage regulator applications

Jeng-Shien Hsieh, Victor C. Y. Chang, Douglas C. H. Yu, 2016, 2016 IEEE International Electron Devices Meeting (IEDM).

Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology

Chuei-Tang Wang, Chih-Hua Chen, Feng-Wei Kuo, 2015, 2015 International 3D Systems Integration Conference (3DIC).

整合品質機能展開與品質工程建構新產品品質指標評估模式-以奈米碳管場發射顯示器為例整合品質機能展開與品質工程建構新產品品質指標評估模式-以奈米碳管場發射顯示器為例整合品質機能展開與品質工程建構新產品品質指標評估模式-以奈米碳管場發射顯示器為例

Jeng-Shien Hsieh, 謝政憲, 2008 .

High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology

C. S. Liu, Wei-Heng Lin, Chung-Hao Tsai, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration

Tzu-Chun Tang, Che-Wei Hsu, Chung-Hao Tsai, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

High Performance Chip-Partitioned Millimeter Wave Passive Devices on Smooth and Fine Pitch InFO RDL

Che-Wei Hsu, Chung-Hao Tsai, Jeng-Shien Hsieh, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).