Mirng-Ji Lii

Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications

Chung-Hao Tsai, Jeng-Shien Hsieh, Monsen Liu, 2013, 2013 IEEE International Electron Devices Meeting.

Flip chip pin grid array (FC-PGA) packaging technology

Mirng-Ji Lii, Hwai Peng Yeoh, B. Sankman, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package

Yuan Li, Chung-Yi Lin, Mirng-Ji Lii, 2004 .

Solder joint reliability modeling for a 540-I/O plastic ball-grid-array assembly

Yung-Cheng Lee, S. Hareb, Mirng-Ji Lii, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).

Characterization of the fatigue properties of bonding wires

Alex Deyhim, Mirng-Ji Lii, B. Yost, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Flip-Chip Technology on Organic Pin Grid Array Packages

Mirng-Ji Lii, Hwai Peng Yeoh, M. Lii, 2000 .

Reliability of high aspect ratio plated through holes (PTH) for advanced printed circuit board (PCB) packages

Mirng-Ji Lii, Hamid R. Azimi, D. Goval, 1997, 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual.

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Yung-Cheng Lee, Teh-Hua Ju, S. Hareb, 2002 .