Sunil Wickramanayaka

Stealth Dicing Challenges for MEMS Wafer Applications

Daniel Ismael Cereno, Sunil Wickramanayaka, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Thin-Film Magnetic Inductor for Integrated Power Management

Jun Yu, Serine Soh, Wei Yi Lim, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Heterogeneous 2.5D integration on through silicon interposer

Xiaowu Zhang, Roshan Weerasekera, Dim-Lee Kwong, 2015 .

6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking

Ling Xie, Ser Choong Chong, Sunil Wickramanayaka, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Study on warpage and stress of TSV wafer with ultra-fine pitch vias for high density chip stacking

Sunil Wickramanayaka, F.X. Che, L. Xie, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Ling Xie, Daniel Ismael, Sunil Wickramanayaka, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Chip to wafer hermetic bonding with flux-less reflow oven

Leong Ching Wai, Sunil Wickramanayaka, Vivek Chidambaram Nachiappan, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).