Fa Xing Che
发表
Xiaowu Zhang,
Jong-Kai Lin,
K. Y. Au,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fa Xing Che,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
H.L.J. Pang,
Fa Xing Che,
T. H. Low,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Fa Xing Che,
F. Che,
2017,
IEEE Transactions on Device and Materials Reliability.
H.L.J. Pang,
Yuqi Wang,
K. H. Low,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
John H. L. Pang,
Fa Xing Che,
B. Xiong,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
John H. L. Pang,
Fa Xing Che,
F. Che,
2007
.
Vempati Srinivasa Rao,
Fa Xing Che,
Kazunori Yamamoto,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Masaya Kawano,
Surya Bhattacharya,
Yong Han,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Shan Gao,
Ser Choong Chong,
Fa Xing Che,
2010,
2010 12th Electronics Packaging Technology Conference.
John H. L. Pang,
Fa Xing Che,
2015,
IEEE Transactions on Device and Materials Reliability.
Suhana Mohd Said,
Mohd Faizul Mohd Sabri,
Irfan Anjum Badruddin,
2013,
Journal of Electronic Materials.