Dongkai Shanguan

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules

Dongji Xie, Daniel T. Rooney, N. Todd Castello, 2007, Microelectron. Reliab..

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds

David Geiger, Daniel T. Rooney, Dongkai Shanguan, 2005, Microelectron. Reliab..