Jae Hak Lee

发表

Design of Bar Horn for Ultrasonic Bonding

Sun-Rak Kim, Jae Hak Lee, Choong D. Yoo, 2009 .

Fault Diagnosis of VCM Type AF Actuator Module for Phone Camera by Vibration Analysis

Jun Yeob Song, Jae Hak Lee, Tae Ho Ha, 2013 .

Robust multi-sensor image registration by enhancing statistical correlation

Jong Beom Ra, Kyoung Soo Kim, Jae Hak Lee, 2005, 2005 7th International Conference on Information Fusion.

Robust CCD and IR Image Registration Using Gradient-Based Statistical Information

Jong Beom Ra, Jae Hak Lee, Dong-Goo Kang, 2010, IEEE Signal Processing Letters.

Design of highly uniform spool and bar horns for ultrasonic bonding

Jun-Yeob Song, Sun-Rak Kim, Jae Hak Lee, 2011, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Multi-sensor image registration based on intensity and edge orientation information

Jong Beom Ra, Jae Hak Lee, Yong Sun Kim, 2008, Pattern Recognit..

Design of Cylinder Horn for Ultrasonic Welding

Sun-Rak Kim, Jae Hak Lee, Choong D. Yoo, 2009 .

A study on wafer level TSV build-up integration method

Jun-Yeob Song, Jae Hak Lee, Tae Ho Ha, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

The Developmental Study of Mathematics Textbook Model Based on Storytelling for 2nd Grade in Middle School

Jae Hak Lee, Bo Euk Suh, Young Cheol Kwon, 2013 .

A study on the edge traces technique for 3D stack chip

Seung S. Lee, Jun-Yeob Song, Sun-Rak Kim, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Migration from RS-485 to EtherCAT for closed loop step motor drive

Jae Wook Jeon, Jae Hak Lee, Jin Ho Kim, 2014, 2014 IEEE International Conference on Industrial Technology (ICIT).

High reliability insert-bump bonding process for 3D integration

Jae Hak Lee, Tae Ho Ha, Jun-Yeob Song, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Compact Assembly Machine for Cellular Phone Lens Module Using Self-Adjustment

Jun-Yeob Song, Jae Hak Lee, Tae Ho Ha, 2009 .

Fabrication of dry-patching superhydrophobic flexible platform for HySiF (hybrid system in flexible) applications

Jun Yeob Song, Jae Hak Lee, Yongjin Kim, 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

An efficient edge traces technique for 3D interconnection of stack chip

Jun-Yeob Song, Sun-Rak Kim, Jae Hak Lee, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Satellite-derived SST validation based on in-situ data during summer in the East China Sea and western North Pacific

Jae Hak Lee, Jae Hak Lee, Young Ho Kim, 2010 .

Reversible resistive switching behaviors in NiO nanowires

Sung In Kim, Jae Hak Lee, Kyung-Hwa Yoo, 2008 .

Reversible resistive switching behaviors in NiO nanowires

Sung In Kim, Jae Hak Lee, Kyung-Hwa Yoo, 2008, 2010 3rd International Nanoelectronics Conference (INEC).

High temperature reliability of Pd-alloyed Au wire/Al bonding interface

Jae Hak Lee, K. Paik, J. Song, 2012, 2012 4th Electronic System-Integration Technology Conference.

Study on a robust insert-bump (ISB) bonding technique for a 3D package

Jae Hak Lee, J. Song, Young-Jun Kim, 2016 .

Method of damage-free three-dimensional step covered interconnection for HySiF (hybrid system in flexible) using electrohydrodynamic jetting

Jae Hak Lee, Yongjin Kim, S. Rhee, 2016 .

ISB Bonding Technology for TSV (Through-Silicon Via) 3D Package

Jae Hak Lee, Seung Man Kim, J. Song, 2014 .

Experimental investigation on micro-fabrication of wearable dry-patching flexible substrate using transparent superhydrophobic polyimide

Jae Hak Lee, Seung Man Kim, Yongjin Kim, 2019, Materials Research Express.

Development of a Next Generation Stretchable Substrate for Micro-LED Application

Jae Hak Lee, J. Song, A. Park, 2022, 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging

Jae Hak Lee, J. Song, Sumin Kang, 2022, Advanced Materials Technologies.

Continuous Patterning of Silver Nanowire-Polyvinylpyrrolidone Composite Transparent Conductive Film by a Roll-to-Roll Selective Calendering Process

Jae Hak Lee, Faizan Ghani, J. Song, 2022, Nanomaterials.

Optimization of process parameters in micro-scale pneumatic aerosol jet printing for high-yield precise electrodes

Jae Hak Lee, J. Song, Seungman Kim, 2023, Scientific reports.