Toshiharu Wada

The defect mitigation on EUV stack by track based technology

Nelson Felix, Cody Murray, Karen Petrillo, 2019, Advanced Lithography.

Line roughness improvements on EUV 36nm pitch pattern by plasma treatment method

Peter Biolsi, Chia-Yun Hsieh, Akiteru Ko, 2019, Advanced Lithography.

Advanced multiple patterning technologies for high density hexagonal hole arrays

Akiteru Ko, Peter Biolsi, Sophie Thibaut, 2021, Advanced Lithography.