Karen Petrillo

发表

Methods for comparing contact hole shrinking techniques with 248-nm single layer and bilayer photoresists

Karen Petrillo, John P. Simons, Ronald A. DellaGuardia, 2002, SPIE Advanced Lithography.

The effect of photoresist/topcoat properties on defect formation in immersion lithography

Gregory Breyta, Gregory M. Wallraff, Karen Petrillo, 2006, SPIE Advanced Lithography.

Enhancement of KRS-XE for 50 keV Advanced Mask Making Applications

Marie Angelopoulos, Karen Petrillo, David R. Medeiros, 2002, Photomask Technology.

Current developments of a high-performance CA resist for mask-making application

Wei He, Marie Angelopoulos, Karen Petrillo, 2003, Photomask Japan.

Hardmask technology for sub-100 nm lithographic imaging

Scott Halle, Timothy A. Brunner, Marie Angelopoulos, 2003, SPIE Advanced Lithography.

High-contrast positive resists for e-beam mask making

Hiroshi Ito, Marie Angelopoulos, Karen Petrillo, 1998, Photomask Technology.

The defect mitigation on EUV stack by track based technology

Nelson Felix, Cody Murray, Karen Petrillo, 2019, Advanced Lithography.

Progress toward developing high performance immersion compatible materials and processes

Kurt R. Kimmel, Karen Petrillo, Takashi Chiba, 2005, SPIE Advanced Lithography.

High-performance e-beam resist coupling excellent dry etch resistance and sub-100-nm resolution for advanced mask and device making

Marie Angelopoulos, Karen Petrillo, David R. Medeiros, 2001, SPIE Advanced Lithography.

New family of non-chemically amplified resists

Inna V. Babich, Marie Angelopoulos, Karen Petrillo, 1998, Advanced Lithography.

Use of KRS-XE positive chemically amplified resist for optical mask manufacturing

Marie Angelopoulos, Karen Petrillo, David R. Medeiros, 2002, SPIE Photomask Technology.

High resolution patterning in chemically amplified resists: the effect of film thickness

Marie Angelopoulos, Karen Petrillo, David R. Medeiros, 2001, SPIE Advanced Lithography.

Silicon containing polymer in applications for 193 nm high NA lithography processes

Karen Petrillo, Allen H. Gabor, Naftali E. Lustig, 2006, SPIE Advanced Lithography.

Process optimization of APEX-E

Karen Petrillo, 1993, Advanced Lithography.

193 lithography and RELACS processing for BEOL lithography

Linda M. Hadel, Richard A. Ferguson, Karen Petrillo, 2001, SPIE Advanced Lithography.

Impact of thin resist processes on post-etch LER

Hiroshi Ito, Martha I. Sanchez, Gregory M. Wallraff, 2003, SPIE Advanced Lithography.

Electron-beam processing of deep-UV resist

Karen Petrillo, William R. Livesay, Matthew F. Ross, 1997, Advanced Lithography.

Extending the performance of KRS-XE for high-throughput electron-beam lithography for advanced mask making

Marie Angelopoulos, Karen Petrillo, Wenjie Li, 2002, SPIE Photomask Technology.

Contact-reducing method over topography by combining the RELACS technique and bilayer process

Karen Petrillo, Chieh-yu Lin, David M. Dobuzinsky, 2002, SPIE Advanced Lithography.

Method to improve setup and overlay performance on an excimer laser stepper using a unique DUV resist: KRS

Karen Petrillo, Wu-Song Huang, Ranee W. Kwong, 1997, Advanced Lithography.

Applicaton of blends and side chain Si-O copolymers as high-etch-resistant sub-100-nm e-beam resists

Marie Angelopoulos, Karen Petrillo, Qinghuang Lin, 2002, SPIE Advanced Lithography.

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node

Karen Petrillo, Andrew Metz, Shinichiro Kawakami, 2010, Advanced Lithography.

Optimization of ESCAP photoresist for x-ray lithography

Gregory Breyta, Donald C. Hofer, Hiroshi Ito, 1994, Advanced Lithography.

Highly etch-selective spin-on bottom antireflective coating for use in 193-nm lithography and beyond

Scott Halle, Marie Angelopoulos, Karen Petrillo, 2003, SPIE Advanced Lithography.