Elke Zakel

A low cost Bumping process for 300 mm wafers

Thomas Oppert, Thorsten Teutsch, Elke Zakel, 1999 .

Method and apparatus for transferring a solder deposit

Elke Zakel, Ghassem Azdasht, 2004 .

Single and multiple laser solder ball placement and reflow for wafer level CSP

Thomas Oppert, Thorsten Teutsch, Elke Zakel, 2000 .

F2-cPACTM - A Manufacturing Process for a Low Cost CSP

Elke Zakel, P. Kasulke, T. Oppert, 1998 .

Chip card and method for generating connection contacts on two major surfaces

Elke Zakel, Rolf Aschenbrenner, 1997 .

Chip module and to methods for producing a chip module

Elke Zakel, Paul Kasulke, Ghassem Azdasht, 1997 .

WLCSP and Flip Chip bumping technologies

Thomas Oppert, Thorsten Teutsch, Elke Zakel, 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

A roadmap to low cost flip chip and CSP using electroless Ni/Au

Thomas Oppert, Thorsten Teutsch, Elke Zakel, 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).

Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Herbert Reichl, Elke Zakel, A. Ostmann, 1996, Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium.

Fluxless flip-chip attachment techniques using the Au/Sn metallurgy

Herbert Reichl, Elke Zakel, Christine Kallmayer, 1995, Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.

Wafer level CSP using low cost electroless redistribution layer

Thomas Oppert, Thorsten Teutsch, Elke Zakel, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

Andreas Ostmann, H. Reichl, Elke Zakel, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.