Stan D. Tsai

Development of a production worthy copper CMP process

S. Nanjangud, Kapila Wijekoon, S. Mishra, 1998, IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168).

Copper CMP and Process Control

Ping Li, Duane S. Boning, Fritz Redeker, 1999 .

A low cost and residue-free abrasive-free copper CMP process with low dishing, erosion and oxide loss

Stan D. Tsai, Lizhong Sun, Lizhong Sun, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Cu Planarization in Electrochemical Mechanical Planarization

Wei-Yung Hsu, Stan D. Tsai, F. Liu, 2006 .

Copper CMP integration and time dependent pattern effect

Kapila Wijekoon, Stan D. Tsai, Ping Li, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).