D. Love

Concepts, implementation and potential of DMRP

D. Love, 1992 .

Design, materials and process for lead‐free assembly of high‐density packages

John H. Lau, Dongkai Shangguan, Jerry Gleason, 2004 .

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Walter Dauksher, 2004 .

Grounding and ground fault protection of multiple generator installations on medium-voltage industrial and commercial power systems II. Grounding methods

G. Dalke, J. Fischer, L. Padden, 2003, Conference Record of the 2003 Annual Pulp and Paper Industry Technical Conference, 2003..

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Walter Dauksher, 2004 .

Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints

D. Love, K. Newman, N. Shimizu, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).