Robert Lo

A 45-nm Dual-Port SRAM Utilizing Write-Assist Cells Against Simultaneous Access Disturbances

Meng-Fan Chang, Quincy Li, Jui-Jen Wu, 2012, IEEE Transactions on Circuits and Systems II: Express Briefs.

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Kuo-Shu Kao, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Kuo-Shu Kao, Ren-Shin Cheng, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

Tai-Hong Chen, John H. Lau, Chau-Jie Zhan, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).