Siegfried Menzel

Thermosonic platinum wire bonding on platinum

Daniel Ernst, Thomas Gemming, Katharina Schulz, 2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.

Grain growth and twinning in copper thin films for ULSI circuits

Klaus Wetzig, Horst Wendrock, Michael Hecker, 1999 .

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Klaus Wetzig, Horst Wendrock, Siegfried Menzel, 2005 .

Effect of Ag-alloying addition on the stress temperature behavior of electroplated copper thin films

Klaus Wetzig, Horst Wendrock, Siegfried Menzel, 2005 .

Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties

Paul S. Ho, D. Utess, Siegfried Menzel, 2011 .

Damaging of metallization layers by high power surface acoustic wave fields

Klaus Wetzig, Siegfried Menzel, Manfred Weihnacht, 2002 .