Mu Feng

发表

3D resist profile full chip verification and hot spot disposition

Qing Yang, Bo Yan, ShyueFong Quek, 2013, Advanced Lithography.

On Joycean Sense of Comedy and Its Global Orientation

Mu Feng, 2002 .

The h-step timely recursive prediction of multivariate MA(q)models

Mu Feng, 2007 .

A full-chip 3D computational lithography framework

Yen-Wen Lu, Qian Zhao, Mu Feng, 2012, Advanced Lithography.

Motion Estimation in the 3-D Gabor Domain

Mu Feng, Todd R. Reed, T. Reed, 2007, IEEE Transactions on Image Processing.

Process window and interlayer aware OPC for the 32-nm node

Gary Zhang, Mu Feng, George Lu, 2007, SPIE Advanced Lithography.

Separable OPC models for computational lithography

Lieve Van Look, Geert Vandenberghe, Jo Finders, 2008, Photomask Japan.

Testing the effectiveness of the λ insulator in hybrid poplar

Mu Feng, 2016 .

Gradient in English Intonation

Mu Feng, 2009 .

A physical resist shrinkage model for full-chip lithography simulations

Xin Guo, Gary Zhang, Qian Zhao, 2016, SPIE Advanced Lithography.

Optimizing OPC data sampling based on "orthogonal vector space"

Dongqing Zhang, Mu Feng, Byoung Il Choi, 2011, Advanced Lithography.

Wafer sub-layer impact in OPC/ORC models for advanced node implant layers

Laurent Depre, Lei Wang, Mu Feng, 2014, Advanced Lithography.

Source mask optimization methodology (SMO) and application to real full chip optical proximity correction

Stephen Hsu, Xiaofeng Liu, Carl Babcock, 2012, Advanced Lithography.

Genetic and ant colony collaborative optimization algorithm based on information entropy and chaos theory

Mu Feng, Mu Feng, 2011 .

Predictive focus exposure modeling (FEM) for full-chip lithography

Yu Cao, Mu Feng, Jun Ye, 2006, SPIE Advanced Lithography.

OPC model accuracy study using high volume contour based gauges and deep learning on memory device

Meng Liu, Lei Wang, Young-Seok Kim, 2019, Advanced Lithography.

A focus exposure matrix model for full chip lithography manufacturability check and optical proximity correction

Mu Feng, Youping Zhang, Hua-yu Liu, 2006, Photomask Japan.

Massive metrology using fast e-beam technology improves OPC model accuracy by >2x at faster turnaround time

Qiang Zhang, Qian Zhao, Lei Wang, 2018, Advanced Lithography.

Fast and accurate 3D mask model for full-chip OPC and verification

Yu Cao, Jiong Jiang, Peng Liu, 2007, SPIE Advanced Lithography.

Two-step variable selection in partially linear additive models with time series data

Zhao Chen, Mu Feng, Ximing Cheng, 2018, Commun. Stat. Simul. Comput..

Compact modeling of negative tone development resist with photo decomposable quencher

Jun Chen, Mu Feng, Keith Gronlund, 2019, Advanced Lithography.

Discussion on Selection of the Stress Standard for the Spring with 2-Grade Stiffness for Railway Freight Cars

Mu Feng, 2003 .

A profile-aware resist model with variable threshold

Laurent Depre, Qian Zhao, Mu Feng, 2012, Photomask Technology.

Resist profile aware source mask optimization

Michael Hsieh, Mu Feng, Stephen Hsu, 2014, Advanced Lithography.

EUV via hole pattern fidelity enhancement through novel resist and post-litho plasma treatment

Carlos Fonseca, Liesbeth Reijnen, Mu Feng, 2018, Advanced Lithography.

Metrology and deep learning integrated solution to drive OPC model accuracy improvement

Ming Li, Wei Yuan, Yanjun Xiao, 2019, Advanced Lithography.

Optimizing OPC data sampling based on

Dongqing Zhang, Mu Feng, Byoung Il Choi, 2011 .

Accurate characterization of 2D etch bias by capturing surrounding effects from resist and trench areas

Mu Feng, Keith Gronlund, Yongfa Fan, 2017, Advanced Lithography.

Dense motion field estimation by 3-D Gabor representation

Mu Feng, Todd R. Reed, 2004, 2004 International Conference on Image Processing, 2004. ICIP '04..

OPC resist model separability validation after SMO source change

Jeroen Van de Kerkhove, Peter De Bisschop, Werner Gillijns, 2013, Advanced Lithography.

An Inquiry into and Reflection on the Current State of Paper Writing Among the Graduating English Majors

Mu Feng, 2001 .

Detection and estimation of rotational motions using the 3-D Gabor representation

Mu Feng, Todd R. Reed, T. Reed, 2005, IEEE International Conference on Image Processing 2005.

Enhancing model accuracy and calibration efficiency with image-based pattern selection using machine learning techniques

Sungho Kim, Mu Feng, Chanha Park, 2021, Advanced Lithography.

Stochastic defect criticality prediction enabled by physical stochastic modeling and massive metrology

Maxence Delorme, Jen-Yi Wuu, Mu Feng, 2021, Advanced Lithography.