Hui-Chun Yu

Mitigation of unintentional radiation from the package lid using PMC packaging

Er-Ping Li, Yong-Sheng Li, Bin Li, 2017, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).

Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs

En-Xiao Liu, Ke Wu, Cheng Zhuo, 2017, IEEE Transactions on Electromagnetic Compatibility.

A Low-Profile Broadband Bandpass Frequency Selective Surface With Two Rapid Band Edges for 5G Near-Field Applications

Ran Hao, Wen-Yan Yin, Er-Ping Li, 2017, IEEE Transactions on Electromagnetic Compatibility.